3M offers a broad line of advanced chemistries that have demonstrated outstanding performance in a wide variety of general electronics cleaning and drying applications.
Selected 3M™ Novec™ Engineered Fluids have properties suitable to wet cleaning of dry etcher parts:
Faster cleaning than IPA or acetone with the use of heat or ultrasonics
Eliminate or reduce manual and ultrasonic cleaning
Dry cleanly with no residue
Low global warming potential and zero ozone depletion potential
Nonflammable and non-VOC (HFE-7100 and HFE-7200)
Low toxicity and excellent materials compatibility
These cleaning fluids will meet both your performance requirements and satisfy the needs of workers and regulators. For dry etcher parts cleaning, we recommend one the following Novec fluids:
New fluid technology offering zero ozone depletion potential (ODP), low global warming potential, and low toxicity. Non-flammable. For use in industrial and commercial cleaning, lubricant deposition, heat transfer and a wide variety of specialty applications.
Wafer Carrier Cleaning Fluids
3M™ Novec™ Engineered Fluids are extremely effective for particulate cleaning of all SEMI-standard 300 mm FOUPs (Front-Opening Unified Pods):
Very fast cycle time
Ability to clean and dry FOUP doors effectively
Low cost of ownership versus aqueous cleaning
High cleaning efficiency
Complete drying
We recommend one of the following Novec fluids for your FOUP cleaning needs:
New fluid technology offering zero ozone depletion potential (ODP), low global warming potential, and low toxicity. Non-flammable. For use in industrial and commercial cleaning, lubricant deposition, heat transfer and a wide variety of specialty applications.
CVD CHAMBER CLEANING
Select 3M™ Specialty Gases are designed as "drop-in" replacements for C2F6 and CF4. Use of 3M Specialty Gases can help wafer processing fabricators meet voluntary PFC emission reduction targets. These specialty gases offer a number of important performance and environmental advantages:
Helps reduce costs through reduced gas usage (up to 60% without sacrificing etch rate)
Helps reduce PFC gas emissions (up to 90% with C4F8O)
Allows use of existing gas lines and controllers
In addition, 3M can assist you with specialized services (such as on-site FTIR analysis) to help you evaluate 3M Specialty Gases, optimize manufacturing processes, recover and recycle spent material and document PFC abatement programs.
We recommend one of the following products for your CVD chamber cleaning applications:
3M™ Specialty Gas PFG-3218
3M™ Specialty Gas PFG-3480
Specialty gases are used in removing material buildup from chemical vapor deposition (CVD) reactor chambers in semiconductor manufacturing. Offers reduced emission, lower gas usage rates and faster chamber cleaning.
Challenge the 3M Team
At 3M, we offer more than great products and superior service. We offer applications design and engineering support solutions for your toughest electronics industry challenges.
